Nā papa kaapuni lehulehu waena TG150 8 papa
Hōʻike huahana:
| Mea Kumu: | FR4 TG150 |
| Mānoanoa PCB: | 1.6+/-10%mm |
| Ka helu papa: | 8L |
| Mānoanoa keleawe: | 1 oz no nā papa āpau |
| Lapaʻau ʻili: | HASL-LF |
| ʻO ka mask solder: | ʻōmaʻomaʻo ʻōlinolino |
| Silkscreen: | Keʻokeʻo |
| Kaʻina hana kūikawā: | Kūlana |
Palapala noi
E hoʻolauna i kekahi ʻike o ka mānoanoa keleawe pcb.
Copper foil like pcb conductive kino, oluolu adhesion i ka insulation papa, corrosion form kaapuni pattern.The manoanoa o ke keleawe foil ua hoike ia ma oz(oz), 1oz=1.4mil, a me ka awelika mānoanoa o ke keleawe foil ua hoikeia ma ke kaumaha o ka wae. wahi ma ke kumu: 1oz=28.35g/ FT2(FT2 kapuai huinaha, 1 kapuai huinaha =0.09290304㎡).
International pcb keleawe foil maʻamau hoʻohana mānoanoa: 17.5um, 35um, 50um, 70um.ʻO ka maʻamau, ʻaʻole hana nā mea kūʻai aku i nā ʻōlelo kūikawā i ka wā e hana ai i ka pcb.ʻO ka mānoanoa keleawe o nā ʻaoʻao hoʻokahi a me nā ʻaoʻao pālua he 35um, ʻo ia hoʻi, 1 amp keleawe.ʻOiaʻiʻo, e hoʻohana kekahi o nā papa kikoʻī i ka 3OZ, 4OZ, 5OZ ... 8OZ, etc., e like me nā koi huahana e koho i ka mānoanoa keleawe kūpono.
ʻO ka mānoanoa keleawe maʻamau o ka papa PCB ʻaoʻao hoʻokahi a ʻelua ʻaoʻao ma kahi o 35um, a ʻo ka mānoanoa keleawe ʻē aʻe he 50um a me 70um.ʻO ka mānoanoa keleawe o ka pā multilayer ma ke ʻano he 35um, a ʻo ka mānoanoa keleawe o loko he 17.5um.ʻO ka hoʻohana ʻana i ka mānoanoa keleawe o ka papa Pcb ma muli o ka hoʻohana ʻana i ka PCB a me ka uila hōʻailona, ka nui o kēia manawa, 70% o ka papa kaapuni e hoʻohana ana i ka 3535um keleawe foil mānoanoa.ʻOiaʻiʻo, no ka nui o ka papa kaapuni o kēia manawa, e hoʻohana ʻia ka mānoanoa keleawe 70um, 105um, 140um (kakaikahi loa)
ʻOkoʻa ka hoʻohana ʻana o ka papa Pcb, ʻokoʻa ka hoʻohana ʻana i ka mānoanoa keleawe.E like me nā mea kūʻai maʻamau a me nā huahana kamaʻilio, e hoʻohana i ka 0.5oz, 1oz, 2oz;No ka hapa nui o kēia manawa nui, e like me nā huahana uila kiʻekiʻe, ka papa lako mana a me nā huahana ʻē aʻe, hoʻohana maʻamau i ka 3oz a i luna paha nā huahana keleawe mānoanoa.
ʻO ke kaʻina hana lamination o nā papa kaapuni e like me kēia:
1. Hoʻomākaukau: E hoʻomākaukau i ka mīkini laminating a me nā mea i makemake ʻia (me nā papa kaapuni a me nā pahu keleawe e hoʻopaʻa ʻia, kaomi ʻana i nā papa, etc.).
2. Hoʻomaʻemaʻe hoʻomaʻemaʻe: E hoʻomaʻemaʻe a deoxidize i ka ʻili o ka papa kaapuni a me ka foil keleawe e paʻi ʻia e hōʻoia i ka hana soldering maikaʻi a me ka hoʻopaʻa ʻana.
3. Lamination: E hoʻopaʻa ʻia ka ʻāpana keleawe a me ka papa kaapuni e like me nā koi, ʻo ka maʻamau hoʻokahi papa o ka papa kaapuni a me hoʻokahi ʻāpana keleawe i hoʻopaʻa ʻia i nā ʻano ʻē aʻe, a ma hope e loaʻa ai kahi papa kaapuni multi-layer.
4. Ke hoʻonohonoho ʻana a me ke kaomi ʻana: e kau i ka papa kaapuni laminated ma ka mīkini paʻi, a kaomi i ka papa kaapuni multi-layer ma ke kau ʻana i ka pā kaomi.
5. Ke kaʻina hana kaomi: Ma lalo o ka manawa a me ke kaomi i koho mua ʻia, hoʻopili ʻia ka papa kaapuni a me ka pahu keleawe e kahi mīkini paʻi i paʻa pono.
6. Hoʻomaʻamaʻa hoʻoluʻu: E kau i ka papa kaapuni i kaomi ʻia ma luna o ke kahua hoʻoluʻu no ka hoʻomaʻamaʻa ʻana, i hiki ai ke hōʻea i kahi kūlana paʻa a me ke kaomi.
7. Ka hana ma hope: E hoʻohui i nā preservatives i ka ʻili o ka papa kaapuni, e hana i ka hana ma hope e like me ka wili, hoʻokomo pin, a me nā mea ʻē aʻe, e hoʻopau i ke kaʻina hana holoʻokoʻa o ka papa kaapuni.
FAQs
ʻO ka mānoanoa o ka papa keleawe i hoʻohana maʻamau ʻia i ka manawa e pono ai ke hele i ka PCB.ʻO ka mānoanoa keleawe maʻamau ma kahi o 1.4 a 2.8 mils (1 a 2 oz)
ʻO ka mānoanoa keleawe PCB liʻiliʻi loa ma kahi laminate ʻaʻahu keleawe he 0.3 oz-0.5oz.
ʻO ka PCB mānoanoa liʻiliʻi he huaʻōlelo i hoʻohana ʻia e wehewehe i ka mānoanoa o kahi papa kaapuni i paʻi ʻia ʻoi aku ka lahilahi ma mua o ka PCB maʻamau.ʻO 1.5mm ka mānoanoa maʻamau o ka papa kaapuni i kēia manawa.ʻO ka mānoanoa liʻiliʻi he 0.2 mm no ka hapa nui o nā papa kaapuni.
ʻO kekahi o nā hiʻohiʻona koʻikoʻi: ka pale ahi, ka dielectric mau, ka helu poho, ka ikaika tensile, ka ikaika shear, ka mahana hoʻololi aniani, a me ka nui o ka mānoanoa o ka hoʻololi ʻana me ka mahana (ka helu hoʻonui Z-axis).
ʻO ia ka mea insulation e hoʻopaʻa ai i nā cores pili, a i ʻole kahi kumu a me kahi papa, i loko o kahi puʻupuʻu PCB.ʻO nā hana maʻamau o prepregs e hoʻopaʻa i kahi kumu i kekahi kumu, hoʻopaʻa i kahi kumu i kahi papa, hāʻawi i ka insulation, a pale i ka papa multilayer mai ka pōkole pōkole.
