Nā Huahana PCB

Mea Kumu: FR4 TG170

Mānoanoa o ka PCB: 0.8 +/- 0.1 mm

Helu Papa: 2L

Mānoanoa Keleawe: 1/1 oz

Ka laulā laina/kaʻawale iki: 15/8 mil

Ka lua liʻiliʻi loa: 0.25mm

Ka mālama ʻili: ENIG 2U”

Pale maka Solder: Polū

Pale silika: Keʻokeʻo

Wahi noi: ʻŌnaehana Brake Core i nā Kaʻa Ikehu Hou

Mea Kumu: FR4 TG130

Mānoanoa o ka PCB: 1.6+/-10% mm

Helu Papa: 8L

Mānoanoa Keleawe: 1/1/1/1/1/1/1/1/1 oz

Ka laulā laina/kaʻawale liʻiliʻi loa: 3.6/4 mil

Ka lua liʻiliʻi loa: 0.2mm

Ka mālama ʻili: ENIG 1U”

Pale maka Solder: ʻEleʻele

Pale silika: Keʻokeʻo

Wahi noi: Kāmela uea ʻole, papa kaapuni hoʻoili wikiō kāmela

Mea Kumu: FR4 TG130 PCB
Mānoanoa: 2.0+/-10% mm
Helu Papa: 6L
Mānoanoa Keleawe: 1/1/1/1/1/1/1 oz
Ka laulā laina/kaʻawale iki: 4/3.05 mil
Ka lua liʻiliʻi loa: 0.25mm
Ka mālama ʻili: ENIG 40U&rdquo
Pale maka Solder: ʻŌmaʻomaʻo
Pale silika: Keʻokeʻo
Wahi noi: FPC Automated Test Fixture High-Performance Probe Interface PCB

Mea Kumu: FR4 TG130
Mānoanoa o ka PCB: 1.6+/-10% mm
Helu Papa: 8L
Mānoanoa Keleawe: 2/2/2/2/2/2/2/2/2 oz
Ka laulā laina liʻiliʻi loa/kaʻawale: 0.18/0.17mm
Ka lua liʻiliʻi loa: 0.1mm
Ka mālama ʻili: ENIG 1U”
Pale maka Solder: ʻEleʻele
Pale silika: Keʻokeʻo
Wahi noi: PCB Luna Hoʻokele Mokulele Drone

Mea Kumu: FR4 TG170
Mānoanoa o ka PCB: 1.6+/-10% mm
Helu Papa: 6L
Mānoanoa Keleawe: 7/7/7/7/7/7/7 oz
Ka mālama ʻili: ENIG 2U”
Pale maka Solder: ʻŌmaʻomaʻo
Pale silika: Keʻokeʻo
Wahi noi: Kikowaena hoʻouka kaʻa uila

Mea Kumu: FR4 TG140
Mānoanoa o ka PCB: 1.6+/-10% mm
Helu Papa: 6L
Mānoanoa Keleawe: 1/1/1/1/1/1/1 oz
Ka mālama ʻili: ENIG 1U”
Pale maka Solder: ʻŌmaʻomaʻo
Pale silika: Keʻokeʻo
Wahi noi: Cloud Computing