ʻOihana PCB uila PCB kiʻekiʻe TG170 12 papa ENIG

ʻO ka PCB Layer Kiʻekiʻe (High Layer PCB) he PCB (Paʻi Kaapuni Papa, paʻi kaapuni papa) me ka ʻoi aku ma mua o 8 mau papa. Ma muli o kāna mau mea maikaʻi o ka papa kaapuni multi-layer, hiki ke hoʻokō ʻia ke kiʻekiʻe kaapuni kiʻekiʻe ma kahi kapuaʻi liʻiliʻi, e hiki ai i ka hoʻolālā kaapuni paʻakikī, no laila ua kūpono loa ia no ka wikiwiki kiʻekiʻe kikohoʻe kaʻina hana, microwave radio frequency, modem, high-end server , mālama ʻikepili a me nā kahua ʻē aʻe. Hana ʻia nā papa kaapuni kiʻekiʻe me nā papa kiʻekiʻe-TG FR4 a i ʻole nā ​​mea substrate kiʻekiʻe kiʻekiʻe, hiki ke mālama i ke kūpaʻa kaapuni i nā ʻano wela kiʻekiʻe, kiʻekiʻe-humidity, a me nā alapine kiʻekiʻe.

E pili ana i nā waiwai TG o nā mea FR4

ʻO ka FR-4 substrate he ʻōnaehana resin epoxy, no laila, no ka manawa lōʻihi, ʻo ka waiwai Tg ka helu maʻamau i hoʻohana ʻia e hoʻokaʻawale i ka papa substrate FR-4, ʻo ia kekahi o nā hōʻailona hana koʻikoʻi i ka IPC-4101 kikoʻī, ka waiwai Tg o ka ʻōnaehana resin, e pili ana i ka mea mai kahi ʻano paʻa a i ʻole ka "aniani" mokuʻāina i ka maʻalahi deformation a i ʻole ka maʻalahi o ka hoʻololi ʻana i ka mahana. Hiki ke hoʻohuli ʻia kēia hoʻololi thermodynamic inā ʻaʻole decompose ka resin. ʻO ia hoʻi, ke hoʻomāhana ʻia kekahi mea mai ka lumi wela a i kahi mahana ma luna o ka waiwai Tg, a laila hoʻomaha ʻia ma lalo o ka waiwai Tg, hiki iā ia ke hoʻi i kona kūlana paʻa mua me nā waiwai like.

Eia nō naʻe, ke hoʻomehana ʻia ka mea i kahi mahana i ʻoi aku ka kiʻekiʻe ma mua o kona kumu waiwai Tg, hiki ke hoʻololi ʻia ke kūlana kūlana hiki ʻole ke hoʻololi. ʻO ka hopena o kēia mahana e pili ana i ke ʻano o ka mea, a me ka decomposition thermal o ka resin. ʻO ka mea maʻamau, ʻoi aku ka kiʻekiʻe o ka Tg o ka substrate, ʻoi aku ka kiʻekiʻe o ka hilinaʻi o ka mea. Inā hoʻohana ʻia ke kaʻina hana kuʻi ʻole ke alakaʻi, pono e noʻonoʻo ʻia ka mahana decomposition wela (Td) o ka substrate. ʻO nā hōʻailona hana koʻikoʻi ʻē aʻe e pili ana i ka thermal expansion coefficient (CTE), ka hoʻoheheʻe wai, nā waiwai adhesion o ka mea, a me nā hoʻāʻo ʻana o ka manawa hoʻohana maʻamau e like me nā hōʻike T260 a me T288.

ʻO ka ʻokoʻa loa ma waena o nā mea FR-4 ka waiwai Tg. E like me ka Tg wela, FR-4 PCB maʻamau mahele i haʻahaʻa Tg, waena Tg a me kiʻekiʻe Tg papa. Ma ka ʻoihana, ʻo FR-4 me Tg a puni 135 ℃ ka mea maʻamau i helu ʻia he haʻahaʻa Tg PCB; Ua hoʻololi ʻia ʻo FR-4 ma kahi o 150 ℃ i waena o Tg PCB. FR-4 me Tg ma kahi o 170 ℃ ua helu ʻia ʻo Tg PCB kiʻekiʻe. Inā nui nā manawa paʻi, a i ʻole nā ​​papa PCB (ʻoi aku ma mua o 14 mau papa), a i ʻole kiʻekiʻe welding wela (≥230 ℃), a i ʻole kiʻekiʻe o ka wela hana (ʻoi aku ma mua o 100 ℃), a i ʻole kiʻekiʻe welding thermal stress (e like me ka nalu soldering), kiʻekiʻe Tg PCB pono e koho ʻia.