ʻO ka PCB ʻeleʻele Soldermask PCB maʻamau me BGA
Hōʻike huahana:
| Mea Kumu: | FR4 TG170+PI |
| Mānoanoa PCB: | Paʻa: 1.8+/-10%mm, lohi: 0.2+/-0.03mm |
| Ka helu papa: | 4L |
| Mānoanoa keleawe: | 35um/25um/25um/35um |
| Lapaʻau ʻili: | ENIG 2U” |
| Palekana Solder: | ʻōmaʻomaʻo ʻōlinolino |
| Silkscreen: | Keʻokeʻo |
| Kaʻina Kūikawā: | ʻoʻoleʻa + lohi |
Palapala noi
I kēia manawa, ua hoʻohana nui ʻia ka ʻenehana BGA i ke kahua kamepiula (kamepiula paʻa, supercomputer, kamepiula pūʻali koa, kelepona kelepona), kahua kamaʻilio (pagers, kelepona lawe lima, modems), kahua kaʻa (nā mea hoʻokele o nā ʻenekini kaʻa, nā huahana leʻaleʻa kaʻa) .Hoʻohana ʻia ia i nā ʻano mea like ʻole passive, ʻo ka mea maʻamau o ia mau arrays, networks a me nā mea hoʻohui.ʻO kāna mau noi kikoʻī e pili ana i ka walkie-talkie, ka mea pāʻani, ke kiʻi kamepiula a me ka PDA, etc.
FAQs
ʻO nā BGA (Ball Grid Arrays) nā ʻāpana SMD me nā pilina ma lalo o ka mea.Hāʻawi ʻia kēlā me kēia pine me kahi pōpō solder.Hoʻokaʻawale ʻia nā pilina a pau i loko o kahi mākia ʻili a i ʻole matrix ma ka ʻāpana.
ʻOi aku ka pilina o nā papa BGA ma mua o nā PCB maʻamau, hiki i nā PCB kiʻekiʻe, ʻoi aku ka liʻiliʻi.No ka mea aia nā pine ma ka ʻaoʻao lalo o ka papa, ʻoi aku ka pōkole o nā alakaʻi, e hāʻawi ana i ka conductivity maikaʻi a me ka wikiwiki o ka hana o ka hāmeʻa.
Loaʻa i nā ʻāpana BGA kahi waiwai kahi e hoʻopili pono ai lākou e like me ka hoʻoheheʻe ʻana o ka solder a paʻakikī e kōkua me ka hoʻokomo pono ʻole..Hoʻopili ʻia ka ʻāpana e hoʻopili i nā alakaʻi i ka PCB.Hiki ke hoʻohana ʻia kahi puʻu no ka mālama ʻana i ke kūlana o ka ʻāpana inā hana ʻia ke kuʻi lima.
Hāʻawi nā pūʻolo BGAʻoi aku ka nui o ka nui o ka pine, ka haʻahaʻa haʻahaʻa haʻahaʻa, a me ka inductance haʻahaʻama mua o nā ʻano pūʻolo ʻē aʻe.ʻO ia ke ʻano o nā pine interconnection a me ka hoʻonui ʻana i ka hana ma nā wikiwiki kiʻekiʻe ke hoʻohālikelike ʻia me nā pūʻulu laina pālua a i ʻole nā paʻi palahalaha.ʻAʻole loaʻa ka BGA me kāna mau hemahema, ʻoiai.
ʻO nā IC BGApaʻakikī ke nānā ma muli o nā pine i hūnā ʻia ma lalo o ka pūʻolo a i ʻole ke kino o ka IC.No laila ʻaʻole hiki ke nānā ʻike a paʻakikī ka de-soldering.ʻO ka BGA IC solder hui me ka PCB pad e maʻalahi i ke koʻikoʻi flexural a me ka luhi ma muli o ke ʻano wela i ke kaʻina hana hoʻoheheʻe hou.
ʻO ka wā e hiki mai ana o BGA Package o PCB
Ma muli o nā kumu o ke kumukūʻai kūpono a me ka lōʻihi, e ʻoi aku ka kaulana o nā pūʻulu BGA i nā mākeke huahana uila a me ka uila i ka wā e hiki mai ana.Eia kekahi, ua hoʻomohala ʻia nā ʻano pūʻolo BGA like ʻole e hoʻokō i nā koi like ʻole i ka ʻoihana PCB, a he nui nā pōmaikaʻi nui ma ka hoʻohana ʻana i kēia ʻenehana, no laila hiki iā mākou ke manaʻolana i ka wā e hiki mai ana ma ka hoʻohana ʻana i ka pūʻolo BGA, inā. loaʻa iā ʻoe ke koi, e ʻoluʻolu e hoʻokaʻaʻike mai iā mākou.
