Huli wikiwiki pcb ili lapaʻau HASL LF RoHS
Hōʻike huahana:
Mea Kumu: | FR4 TG140 |
Mānoanoa PCB: | 1.6+/-10%mm |
Ka helu papa: | 2L |
Mānoanoa keleawe: | 1/1 oz |
Lapaʻau ʻili: | HASL-LF |
ʻO ka mask solder: | Keʻokeʻo |
Silkscreen: | ʻeleʻele |
Kaʻina hana kūikawā: | Kūlana |
Palapala noi
ʻO ke kaʻina hana HASL papa kaapuni e pili ana i ke kaʻina HASL pad, ʻo ia hoʻi ka uhi ʻana i ka tin ma ka ʻāpana pad ma ka ʻili o ka papa kaapuni. Hiki iā ia ke pāʻani i ka hana o ka anti-corrosion a me ka anti-oxidation, a hiki ke hoʻonui i ka wahi pili ma waena o ka pad a me ka mea i hoʻopaʻa ʻia, a hoʻomaikaʻi i ka hilinaʻi o ka soldering. ʻO ke kaʻina hana kikoʻī e pili ana i nā ʻanuʻu he nui e like me ka hoʻomaʻemaʻe ʻana, ka hoʻoheheʻe kemika o ka tin, ka ʻū ʻana, a me ka holoi ʻana. A laila, ma ke kaʻina hana e like me ka hoʻoheheʻe ʻana i ka ea wela, e hana ia i mea paʻa ma waena o ke kī a me ka mea splice. ʻO ka pulupulu ʻana i ka tin ma nā papa kaapuni kahi hana maʻamau a hoʻohana nui ʻia i ka ʻoihana hana uila.
ʻO ke alakaʻi HASL a me ke alakaʻi ʻole HASL ʻelua mau ʻenehana lapaʻau ʻili i hoʻohana nui ʻia no ka pale ʻana i nā ʻāpana metala o nā papa kaapuni mai ka corrosion a me ka oxidation. Ma waena o lākou, ua haku ʻia ka hui o ke kēpau HASL me 63% tin a me 37% lead, ʻoiai ʻo HASL me ke alakaʻi ʻole i haku ʻia me ka tin, keleawe a me nā mea ʻē aʻe (e like me ke kālā, nickel, antimony, etc.). Ke hoʻohālikelike ʻia me ka HASL me ke alakaʻi, ʻo ka ʻokoʻa ma waena o ka HASL me ke alakaʻi ʻole he ʻoi aku ka maikaʻi o ke kaiapuni, no ka mea, he mea ʻino ke kēpau e hoʻopilikia i ke kaiapuni a me ke olakino kanaka. Eia kekahi, ma muli o nā mea like ʻole i loaʻa i ka HASL me ke alakaʻi ʻole, ʻokoʻa iki kona kūʻai ʻana a me nā waiwai uila, a pono e koho ʻia e like me nā koi noi kikoʻī. ʻO ka ʻōlelo maʻamau, ʻoi aku ka kiʻekiʻe o ke kumukūʻai o ka HASL lead-free ma mua o ko ke alakaʻi HASL, akā ʻoi aku ka maikaʻi o ka mālama ʻana i ke kaiapuni a me ka hoʻokō ʻana, a ua makemake nui ʻia e nā mea hoʻohana hou aʻe.
I mea e hoʻokō ai i ke kuhikuhi RoHS, pono nā huahana papa circuit e hoʻokō i kēia mau kūlana:
1. ʻO ka maʻiʻo o ke kēpau (Pb), mercury (Hg), cadmium (Cd), hexavalent chromium (Cr6+), polybrominated biphenyls (PBB) a me polybrominated diphenyl ethers (PBDE) pono e emi iho ma mua o ka waiwai palena.
2. Pono nā mea o nā metala makamae e like me ka bismuth, ke kālā, ke gula, ka palladium, a me ka platinum i loko o nā palena kūpono.
3. Pono ka mea halogen ma lalo o ka waiwai palena i kuhikuhi ʻia, me ka chlorine (Cl), bromine (Br) a me ka iodine (I).
4. Pono ka papa kaapuni a me kona mau ʻāpana e hōʻike i ka ʻike a me ka hoʻohana ʻana i nā mea ʻona a me nā mea ʻino. ʻO ka mea i luna nei kekahi o nā kumu nui no nā papa kaapuni e hoʻokō i ke kuhikuhi RoHS, akā pono e hoʻoholo ʻia nā koi kikoʻī e like me nā lula a me nā kūlana kūloko.
FAQs
ʻO HASL a i ʻole HAL (no ka ea wela (solder) leveling) he ʻano hoʻopau i hoʻohana ʻia ma nā papa kaapuni paʻi (PCB). Hoʻokomo pinepine ʻia ka PCB i loko o ka ʻauʻau ʻauʻau i hoʻoheheʻe ʻia i uhi ʻia nā ʻili keleawe a pau e ka solder. Hoʻopau ʻia ka solder nui ma ke kau ʻana i ka PCB ma waena o nā pahi wela.
HASL (Maʻamau): ʻO Tin-Lead - HASL (Lead Free): ʻO Tin-Copper, Tin-Copper-Nickel, a i ʻole Tin-Copper-Nickel Germanium. Mānoanoa maʻamau: 1UM-5UM
ʻAʻole ia e hoʻohana i ka solder Tin-Lead. Akā, hiki ke hoʻohana ʻia ʻo Tin-Copper, Tin-Nickel a i ʻole Tin-Copper-Nickel Germanium. Hoʻolilo kēia i ka HASL Lead-Free i koho kūpono a me ka RoHS.
Hoʻohana ʻia ʻo Hot Air Surface Leveling (HASL) i ke alakaʻi ma ke ʻano he ʻāpana o kāna alloy solder, i manaʻo ʻia he pōʻino i ke kanaka. Eia nō naʻe, ʻaʻole hoʻohana ʻo Lead-free Hot Air Surface Leveling (LF-HASL) i ke alakaʻi ma ke ʻano he solder alloy, e palekana ai i ke kanaka a me ke kaiapuni.
Loaʻa ka HASL a loaʻa nui
Loaʻa iā ia ka solderability maikaʻi a me ke ola papa maikaʻi.