Nā papa kaapuni i paʻi mua ʻia RED solder mask nā lua
Hōʻike huahana:
| Mea Kumu: | FR4 TG140 |
| Mānoanoa PCB: | 1.0+/-10% mm |
| Ka helu papa: | 4L |
| Mānoanoa keleawe: | 1/1/1/1 oz |
| Lapaʻau ʻili: | ENIG 2U” |
| ʻO ka mask solder: | ʻulaʻula ʻālohilohi |
| Silkscreen: | Keʻokeʻo |
| Kaʻina hana kūikawā: | Pth hapalua puka ma nā ʻaoʻao |
Palapala noi
ʻO nā kaʻina hana o nā lua hapalua i uhi ʻia:
1. E hana i ka lua hapalua ʻaoʻao me ka mea hana ʻoki ʻano V pālua.
2. Hoʻohui ka lua o ka lua i nā puka alakaʻi ma ka ʻaoʻao o ka lua, e wehe i ka ʻili keleawe ma mua, e hoʻemi i nā burrs, a hoʻohana i nā ʻoki ʻoki ma kahi o nā drills e hoʻonui i ka wikiwiki a hāʻule ka wikiwiki.
3. E hoʻokomo i ke keleawe e hoʻoheheʻe i ka substrate, i hoʻopili ʻia kahi papa keleawe ma ka paia puka o ka puka poepoe ma ka lihi o ka papa.
4. Iecaianoaaiiuo o ka o waho kaapuni kaapuni ma hope o lamination, ike, a me ka ulu ana o ka substrate ma ke kaʻina, ka substrate ua hoʻokauʻia i ka lua keleawe plating a me ka tin plating, no laila, i ke keleawe papa ma ka paia puka o ka poepoe puka ma ka lihi o ua mānoanoa ka papa a ua uhi ʻia ka ʻāpana keleawe me ka uhi ʻia e kahi papa tin no ka pale ʻana i ka corrosion;
5. ʻOki ʻia ka hapalua puka i ka puka poepoe ma ka ʻaoʻao o ka papa ma ka hapalua a lilo i hapalua;
6. Ma ke kaʻina o ka wehe ʻana i ke kiʻiʻoniʻoni, ua hoʻoneʻe ʻia ke kiʻi anti-electroplating i kaomi ʻia i ka wā o ke kaʻina hana paʻi kiʻi;
7. Hoʻopaʻa ʻia ke kālai ʻana i ka substrate, a wehe ʻia ke keleawe i ʻike ʻia ma ka ʻaoʻao o waho o ka substrate e ka etching;
8. Hoʻopau ʻia ka tin e wehe ana i ka substrate i ka tin, i hiki ke hoʻoneʻe ʻia ka tin ma ka pā hapalua puka, a ʻike ʻia ka papa keleawe ma ka pā hapalua puka.
9. Ma hope o ka hana ʻana, e hoʻohana i ka lipine ʻulaʻula e hoʻopili i nā papa hui, a wehe i nā burrs ma o ka laina etching alkaline.
10. Ma hope o ka lua o ka hoʻopaʻa ʻia ʻana o ke keleawe a me ka hoʻopaʻa ʻia ʻana o ke tini ma luna o ke pani, ua ʻoki ʻia ka puka poepoe ma ka ʻaoʻao o ka papa i ka hapalua a lilo i hapalua, no ka mea, ua uhi ʻia ka papa keleawe o ka pā puka me kahi papa tin, a me ka ʻO ka papa keleawe o ka pā puka ua paʻa loa me ka ʻāpana keleawe o ka papa waho o ka substrate Connection, e pili ana i ka ikaika hoʻopaʻa ikaika, hiki ke pale pono i ka ʻāpana keleawe ma ka pā puka mai ka huki ʻana a i ʻole ke kala keleawe i ka wā e ʻoki ai;
11. Ma hope o ka pau ʻana o ka hana ʻana o ka hapalua, wehe ʻia ke kiʻiʻoniʻoni a hoʻopaʻa ʻia, i ʻole e oxidized ka ʻili keleawe, me ka pale ʻana i ke koena o ke keleawe a i ʻole ka pōkole pōkole, a me ka hoʻomaikaʻi ʻana i ka hopena o ka hapalua metala. -puka PCB papa kaapuni.
FAQs
ʻO ka hapalua lua a i ʻole ka lua-castellated, he ʻaoʻao me ke ʻano o ka peʻa ma ka ʻoki ʻana i ka hapalua ma ka outline.He kiʻekiʻe ke kiʻekiʻe o nā ʻaoʻao i hoʻopaʻa ʻia no nā papa kaapuni i paʻi ʻia, i hoʻohana mau ʻia no nā pilina papa-a-papa.
Hoʻohana ʻia ʻo Via ma ke ʻano he interconnection ma waena o nā papa keleawe ma kahi PCB aʻo ka PTH i hana nui ʻia ma mua o nā vias a ua hoʻohana ʻia ma ke ʻano he lua i uhi ʻia no ka ʻae ʻana i nā alakaʻi ʻāpana - e like me nā mea kū'ē non-SMT, capacitors, a me DIP package IC.Hiki ke hoʻohana ʻia ʻo PTH ma ke ʻano he mau puka no ka hoʻopili mechanical ʻoiai ʻaʻole hiki i ka vias.
ʻO ka hoʻopaʻa ʻana i nā lua ma waena he keleawe, he conductor, no laila e ʻae ai i ka conductivity uila e hele ma ka papa.ʻAʻohe conductivity i hoʻopaʻa ʻole ʻia i loko o nā lua, no laila inā hoʻohana ʻoe iā lākou, hiki iā ʻoe ke loaʻa nā ala keleawe maikaʻi ma kekahi ʻaoʻao o ka papa.
Aia nā ʻano puka 3 i loko o kahi PCB, Plated Through Hole (PTH), Non-Plated Through Hole (NPTH) a me Via Holes, ʻaʻole pono e huikau kēia me nā Slots a i ʻole Cut-outs.
Mai ka maʻamau IPC, ʻo +/- 0.08mm no ka pth, a me +/- 0.05mm no ka npth.
