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ʻO ka lawelawe PCB Cloud Computing Prototype 94V-0 Kina
Nā kikoʻī huahana
| Mea Kumu: | FR4 TG140 |
| Mānoanoa o ka PCB: | 1.6+/-10% mm |
| Helu Papa: | 6L |
| Mānoanoa Keleawe: | 1/1/1/1/1/1/1 auneke |
| Ka mālama ʻili: | "1U wale nō" |
| Pale maka hao: | ʻōmaʻomaʻo |
| Pale silika: | Keʻokeʻo |
| Wahi noi: | Kamepiula Ao |
PCB 6-Layer Hana Kiʻekiʻe no ka Cloud Computing - Hoʻonā PCB Prototype Kina hilinaʻi
Ke ʻimi nei i nā papa kaapuni paʻi kiʻekiʻe no kāu lako kamepiula ao?
Ua hoʻolālā kūikawā ʻia kā mākou papa papa 6-papa holomua no nā ʻano hana koʻikoʻi. Hana ʻia me ka mea FR4, he 1.6mm ka mānoanoa o ka papa i hoʻopau ʻia, 1oz ka mānoanoa o ke keleawe o loko/waho, a me 1μ" ka hoʻopau ʻana i ka ʻili gula hoʻokomo, e hāʻawi ana i ka kūpaʻa hōʻailona kūikawā a me ka hiki ke solder.
Ua hōʻoia ʻia ka papa i ke kūlana pale ahi 94V-0, e hoʻokō ana i nā koi palekana koʻikoʻi. ʻO nā palena koʻikoʻi e pili ana i ka laulā laina liʻiliʻi loa he 3.3/3.8mil/spacing, ka nui o ka lua wili liʻiliʻi loa he 0.2mm, a me ka ʻae ʻana o ka lua-a-i-ka-papa-loko he 6mil, e hōʻoiaʻiʻo ana i ke alahele kiʻekiʻe a me ka hana hilinaʻi.
Ma ke ʻano he mea hana PCB hilinaʻi ma Kina, hāʻawi mākou i ke kākoʻo piha mai ka prototyping a i ka hana nui. Ma kēia wahi o ka holomua wikiwiki i ka ʻenehana kamepiula a me ke ao, lawelawe ka Printed Circuit Board (PCB) ma ke ʻano he kahua kumu no nā ʻāpana uila āpau.
Ma nā kikowaena kiʻekiʻe a me nā kikowaena ʻikepili, hana kēia mau papa PCB multi-layer, kiʻekiʻe-frequency ma ke ʻano he "puʻuwai paʻa" o ka helu ao. Hoʻomaʻamaʻa lākou i ka hoʻoili ʻikepili wikiwiki, e hōʻoia ana i ka pono o ka hōʻailona ma waena o ka CPU, GPU, a me ka hoʻomanaʻo e kākoʻo i nā helu like nui a me ke kahe ʻana o ka pākaukau mamao. ʻO kā lākou hoʻokele wela kiʻekiʻe a me ka pono o ka mana he mea nui ia no ka hōʻoia ʻana i ka hana kikowaena 24/7 me ka ʻole o ka hoʻopaʻa ʻia.
No nā mea hoʻohana hope loa, inā he mau kikowaena komo māmā a i ʻole nā kikowaena hana kiʻekiʻe, hoʻoikaika ka hoʻolālā PCB i ka compactness a me ka pono. Hiki i ka ʻenehana High-Density Interconnect ke hoʻonohonoho i nā hoʻonohonoho motherboard compact me ka hoʻohui hana nui aʻe, ʻoiai ʻo ka hoʻokele mana i hoʻomaikaʻi ʻia e hāʻawi i kahi ʻike pākaukau ao maʻalahi a haʻahaʻa.